Cooling project

Bench concept / physical testing planned

Direct-to-Chip Cooling Bench.

Turning a thermal measurement question into an instrumented test concept.

Liquid coolingInstrumentationTest planning
100–400 WRepresentative planning range
0.5–2.0 L/minRepresentative planned coolant-flow range
COLD PLATEHEAT EXCHANGERPUMPT OUTT INQ̇ = ṁ cₚ ΔTCOOLANT HEAT REMOVALCONCEPTUAL / NOT TO SCALE
Conceptual cooling loop · physical testing planned.

Objective

Connect thermal theory, hardware, instrumentation, and data analysis through a single-branch liquid-cooling validation bench concept using a commercial cold plate.

Engineering

The plan centers on coolant energy balance, pressure drop, thermal resistance, hydraulic power, repeatability, and measurement uncertainty. Thermal resistance requires a clearly defined temperature reference and measurement boundary.

Design work

Planned measurements include coolant inlet and outlet temperatures, flow rate, pressure difference, and heater voltage and current. These would support comparisons across controlled heat-input and coolant-flow conditions.

Representative planning ranges are 100–400 W and 0.5–2.0 L/min, also used in synthetic software fixtures. Final operating conditions depend on equipment selection and review.

Verification plan

Use defined sensor locations, calibration records, repeated tests, and uncertainty estimates to compare analytical predictions with future measurements. Hardware and test conditions still require review before physical implementation.

Current status

The independent bench is a design concept with companion analysis software implemented. Assembly and physical testing are planned.

Current learning focus

Turning a desired measurement into explicit sensor locations, definitions, uncertainty sources, and repeatable procedures.

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